In semiconductor industry, one must approach software management and process very differently from traditional software management and process techniques. The key challenge is that one needs to manage three different software streams in one software branch:

• New ASIC support
• New features
• Customer product requirements

These three streams have different delivery constraints, different qualification requirements and very different development timeline. The easiest way would be to separate software delivery into separate software branches. Unfortunately this often leads to a completely unmanageable situation where the workload and resource requirements grow exponentially.

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